BTS115 Frequency Dependent Material Properties- so what?
This is the DesignCon 2010 paper I presented with my partners Don DeGroot, Sanjeev Gupta and Colin Warwick. We look at how the frequency dependent material properties are described so that they rem...read more. |
BTS209 ABCs of De-Embedding
Chapter 10 of Signal Integrity Characterization Techniques by Mike Resso and Eric Bogatin. In this chapter, we discuss the ABC’s of De-Embedding. This chapter is probably the simplest description of de-embedding published anywhere. We sta...read more. |
BTS113 Establish Confidence in PDN Simulation
This is an extensive application note I wrote which reviews a process for evaluating the accuracy of a tool to simulate the impedance profile of the power distribution network including the planes, decoupling capacitors and th...read more. |
BTS032 Chapter 3 of Signal and Power Integrity- Simplified
This is chapter 3, “Impedance and Electrical Models ”, of my book, Signal Integrity Simplified.This chapter is in the public domain and includes color copies of some of the figures. Models are a s...read more. |
BTS031 Chapter 1 of Signal and Power Integrity- Simplified
This is chapter 1, “Signal Integrity is in Your Future”, of my book, Signal Integrity Simplified. This chapter is in the public domain and includes color copies of some of the figures. If you...read more. |
BTS005 IC Packaging Technology at the Turn of the Century
Written by Eric Bogatin and published in IC Insights, a publication of Integrated Circuit Engineering, published in 2000. This chapter describes the new IC packaging technologies coming int...read more. |
BTS011 Differential Impedance Design and Verification with TDR
By Eric Bogatin and Mike Resso, presented at DesignCon 2000 Differential impedance circuit boards are becoming more common as low voltage differential signaling (LVDS) devices prolifer...read more. |
BTS015 PCB Impedance Design: Beyond the IPC Recommendations
By Eric Bogatin, presented at DesignCon 1999 Controlled impedance circuit boards are the norm. Establishing the design rules for the PCB stack up is often hit or miss. Whatever rule of thumb a designer...read more. |
BTS017 Practical Characterization and Analysis of Lossy Transmis
Written by Eric Bogatin, Mike Resso and Steve Corey and published in DesignCon 2001 In this paper, we eliminate the confusion about lossy transmission lines by showing that using off the shelf Ti...read more. |
BTS021 Signal Integrity
written by Eric Bogatin and published in Circuitree Magazine, Dec 2000Ironically, we are in an era where not only are rise times decreasing and signal integrity problems increasing, but the time we hav...read more. |
BTS023 Signal Integrity Performance Characterization for Network
written by Eric Bogatin, Orlando Bell, Gary Otonari, Arthur Fraser, Straty ArgyrakisThis is a paper presented at DesignCon 2002. Network class ...read more. |
BTS034 Differential Impedance Measurement with TDR
By Eric Bogatin and Mike Resso, Published as an Agilent App Note 1382-5, March, 2000 This is a general, introductory app note on how a dual channel TDR can be set up to measure the different...read more. |
BTS036 Design for Minimizing EMI in High Frequency rf and Digita
Written by Eric Bogatin and published as a private report, Spring 1999 There is no magic bullet that will cure all EMI (Electro-Magnetic Interference) problems. Rather, there are a number of old,...read more. |
BTS095 Data Mining 12-Port S-Parameters
By Eric Bogatin, and Mike Resso, originally published in DesignCon 2008Everything you ever wanted to know about a single differential channel is contained in its 4-Port S-Parameters, except for channel...read more. |
BTS106 Si9000 Simulator Accuracy
In this extensive app note, we introduce a methodology for evaluating the accuracy of a transmission line simulation tool and apply it to the Polar Instruments Si9000. We show the pitfalls of the traditional...read more. |
BTS107 Practical Analysis of Backplane Vias
This is the complete paper I presented at DesignCon 2009 related to the measurement, simulation and analysis of backplane vias. We show how to model a differential via that takes into account the via barrel and st...read more. |
BTS109 Electrical Performance of HDI Interconnects
This is a chapter I wrote for the HDI Handbook, available from Iconnect007. This chapter reviews the electrical performance advantages of HDI or micro via substrates. In particular, the advantages of thin laminate...read more. |
BTS181 Roadmaps of Packaging Technologies
This is the first chapter in the book I wrote, Roadmaps of Packaging Technologies. Though it came out in 1998, many of the principles and details are still current today. In this chapter, I present a perspective on the role of packaging technol...read more. |
BTS182 End User Roadmaps
This is chapter 2 in the book I wrote, Roadmaps of Packaging Technologies. Though it came out in 1998, many of the principles and details are still current today. In this chapter, I discuss the needs of the end user that drive electronic product d...read more. |
BTS183 Metrics for Technology Performance
This is chapter 3 in the book I wrote, Roadmaps of Packaging Technologies. Though it came out in 1998, many of the principles and details are still current today. In this chapter, I discuss how we measure performance. What are the metrics used to ...read more. |
