BTS002 What Really is Characteristic Impedance
By Eric Bogatin, Originally published in PCD&M Magazine, Jan 2000. read more. |
BTS006 What Really is Inductance?
by Eric Bogatin, published in Printed Circuit Design and Manufacturing, March 2000read more. |
BTS008 New Design Methodologies for a New Clock Frequency Regime
By Eric Bogatin, originally published in Computer Design Magazine, Jan 1999 This general review paper introduces the ...read more. |
BTS009 Creating Design Rules for Interconnect Substrates
By Eric Bogatin and published in Proc of IMAPS Annual Conf, Oct 1997 The most effective method of establishing t...read more. |
BTS010 Bouncing Out Ground Bounce
By Eric Bogatin and published in PCD&F, Aug, 2003 Ground bounce is a form of cross talk that arises when sig...read more. |
BTS013 What You Lose from a Lossy Line
by Eric Bogatin and Gene Garat, Originally published in EDN Magazine, Feb 19, 2004. read more. |
BTS018 Rules of Thumb I have Known and Loved
By Eric Bogatin, originally posted Oct 31, 1999 read more. |
BTS020 Critical Length of a Transmission Line
by Eric Bogatin. Originally posted on Oct 1, 2004All interconnects are always transmission lines and can always be modeled a...read more. |
BTS022 Signal Integrity and HDI
written by Eric Bogatin and published in Circuitree Magazine, June 1999HDI technology, also known as micro via or build up circuit boards, uses fine lines, thin dielectric layers and vias typically 5 mils in dia...read more. |
BTS024 How Do You Spell S-Parameters?
by Eric Bogatin, originally published in PCD&M, Feb 2003S-Parameters are a powerful formalism to describe the high frequency behvavior of interconnects. In its simplest form of insertion and return loss, it ...read more. |
BTS025 Where will PCBs be after the SoC Revolution?
by Eric Bogatin and written for Electronic Products Magazine, Jan 2000. In this column I address the question of how circuit board designs will be affected by the system on a chip revolution.read more. |
BTS027 The Power of Planes
This is a feature article I wrote for the Feb 2002 issue of PCD&F Magazine about the low inductance of power and ground planes as the real benefit of thin laminates. I describe the current flow in planes and i...read more. |
BTS028 Field Solvers and PCB Stack up Analysis: Comparing Measur
Written by Eric Bogatin, Mike Justice, Todd DeRego and Steve Zimmer, read more. |
BTS029 Analysis of Board Layout Helps Cure Jitter Problems
Written by Eric Bogatin and Gene Garat Published in the EDN Magazine, Aug 5, 2004read more. |
BTS030 Backplane Characterization Techniques
by Eric Bogatin and published in the Xcell Journal, Summer 2004.This is a general overview paper on some of the challenges of fixturing and measuring the electrical properties of&...read more. |
BTS033 Understanding Signal Integrity
By Eric Bogatin and published as an Agilent Application Note, in 2004 read more. |
BTS035 Inductance Analysis of Chip Scale Packages
Written by Eric Bogatin, David Light and Bill Beale Published in 1999 Chip Scale International Conference,...read more. |
BTS038 Electrical Modeling of Connectors using Partial Inductanc
written by Eric Bogatin, Gus Panela and Mike Brenneman and published in the Proceedings of the IICIT Conf, 1997. In this paper, we review how to model multiple conductors in a pni-in-box type connector in terms of their partial indu...read more. |
BTS039 Has Copper Reached its Limits?
Written by Eric Bogatin and originally published in Printed Circuit Design and Manufacture Magazine, Jan 2004It used to be said that you could never send 2.5 Gbps signals down a c...read more. |
BTS040 New Packaging Driver Network Application Chips
Originally posted in Semiconductor International Magazine on April 2001 Key words: package design, package technology read more. |
