|
 |
Sign in |
 |
|
|
Subscription Info |
|
|
|
|
 |
Categories |
|
|
|
Purchase Book |
|
|
| |
|
|
Welcome! Members please sign in or create a free account to get enhanced access to the site.
| In the News |
 |
| Check here to find out what is happening next with Bogatin Enterprises. Click here for a list of previous presentations that you can download. |
|
  Eric to speak at Huntsville EMC Society meeting - April 20, 2010
Eric will be speaking at the Huntsville Chapter of the IEEE Electromagnetic Compatibility (EMC) Society on the topic: “EMC 2010: SI and EMC – A Twisted Pair” on Tuesday, April 20th at the Von Braun Center. IEC Congratulates DesignCon 2010 Paper Award Winners - March 11, 2010 FOR IMMEDIATE RELEASE
Kim Simpao
Phone: +1-312-559-3658
E-Mail: ksimpao@iec.org
IEC Congratulates DesignCon 2010 Paper Award Winners
International Engineering Consortium (IEC) gives recognition to the Paper Award Winners from DesignCon 2010’s conference and exhibition
CHICAGO – March 11, 2010 – The International Engineering Consortium today announced the winners of the 2010 DesignCon Paper Awards in recognition for their outstanding contributions to the educational goals of DesignCon 2010.
"We extend our congratulations to the Design Paper Award winners for their hard work and dedication in serving the semiconductor industry," commented IEC president, John Janowiak. "We are fortunate to have witnessed this caliber of expertise throughout the DesignCon educational program.”
Winners were chosen from the DesignCon 2010 technical program Paper Award finalists papers. The Technical Program Committee selected the Award papers based on written merit and quality of presentation.
The 2010 DesignCon Paper Award winners include the following individuals in their respective categories:
Chip-Level Design
Andres Takach - Creating C ++ IP for High Performance Hardware Implementations of FFTs
Luke Teyssier - Strong Encryption and Correct Design Are Not Enough: Protecting Your Secure System from Side Channel Attacks
Board and System Design
Allen F. Horn III, John W. Reynolds, Patricia A. LaFrance, and James C. Rautio - Effect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High Frequency Transmission Lines
Kevin Hinckley, Douglas Winterberg, Mike Ballou, Gustavo Blando, Jason R. Miller, Roger Dame, Alexander Nosovitski, Gregory Truhlar, Shelley Begley and Istvan Novak - Introduction and Comparison of an Alternate Methodology for Measuring Loss Tangent of PCB Laminates
Interconnect Design
Eric Bogatin, Don DeGroot, Colin Warwick and Sanjeev Gupta - Frequency Dependent Material Properties: So What?
Jason R. Miller, Gustavo J. Blando and Istvan Novak - Additional Trace Losses due to Glass-Weave Periodic Loading
High-Speed Design and Test Category
Ransom Stephens and John Calvin - A New Method for Receiver Tolerance Testing Using Crest Factor Emulation
Istvan Novak, Yasuhiro Mori, and Mike Resso - Accuracy Improvements of PDN Impedance Measurements in the Low to Middle Frequency Range
Power and RF Design Category
Shishuang Sun, Larry D Smith and Peter Boyle - On-Chip PDN Noise Characterization and Modeling
Xiaoxiong Gu, Renato Rimolo-Donadio, Zhenwei Yu, Francesco de Paulis, Young H. Kwark, Matteo Cocchini, Mark B. Ritter, Bruce Archambeault, Albert Ruehli, Jun Fan and Christian Schuster - Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis
Award winning papers and finalists papers will be featured throughout the year in the DesignCon newsletter and InfoVault, and on-line resource for the DesignCon community. For more information, visit www.designcon.com, or contact Kim Simpao at ksimpao@iec.org or +1-773-315-7779.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org. The HDI Handbook now available for downloading The HDI Handbook is a comprehensive resource on high-density interconnect technology for end-users, designers, and fabricators. You can read a short review of the entire book and download a free copy from www.hdihandbook.com. A quick summary of Chapter Four, contributed by Dr. Bogatin, follows below.
Summary of Chapter Four: Electrical Performance
The good old days of 10 to 16 MHz clock frequencies are gone. It used to be the chief design challenge in circuit boards or packages was routing all the signals in two layers and getting packages that wouldn’t crack during assembly. The electrical properties of the interconnects were not important because they didn’t affect system performance. But the world has changed in the past 10 years. Clock frequencies on chip now are over 3 GHz, and on board, are over 800 MHz. In most systems, as the clock frequency goes up, the rise time always gets shorter. A shorter rise time means signal integrity problems increase dramatically. Signal integrity is broadly concerned with the problems that arise from how the electrical properties of the interconnects and power distribution affect system performance. External signals can affect noise as well as the return path for signals along planes. HDI provides miniaturization, smaller and shorter vias, shorter interconnect lengths with smaller parts and finer pitch devices, thinner and lower dielectric-laser drillable dielectrics and embedded components. These can be enabling techniques for improved high-frequency electrical performance.
www.hdihandbook.com
EE Times Interview for New Science Fiction Novel by Dr. Eric Bogatin Rick Merritt at EE Times has published an interview with Eric about his new Science Fiction novel. Titled "Shadow Engineer" it's now available through Amazon. Check it out and let Eric know what you think! Signal Integrity Characterization Techniques now available from the IEC Signal Integrity Characterization Techniques by Mike Resso and Eric Bogatin addresses the gap between traditional digital and microwave measurement technologies while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors, PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must now be optimized using today's most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test and must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements from backplane design challenges to advanced error correction techniques to jitter measurement tools. The authors' approach wisely address many of today's high-speed technologies, provides excellent insight into its future direction, and will teach the reader valuable lessons pertaining to the signal integrity industry. Order the print or CD-ROM edition from the International Engineering Consortium. PRESS RELEASE - December 2009 Webinar Announced - October 26, 2009
Power Integrity Webinar to be presented by Dr. Eric Bogatin
Olathe, KS - Oct 21, 2009
Bogatin Enterprises and beTheSignal.com announce the last Webinar for 2009 in the No Myths Allowed Webinar series. This popular series of five Webinars has drawn more than 1,500 registered viewers. Topics have included S-parameters, differential pairs and high-speed serial links.
On December 9, Dr. Eric Bogatin will present the year’s final Webinar, “Selecting Capacitor Values for the Power Delivery Network.” Created in collaboration with Larry Smith of Altera, this Webinar will answer some of the most confusing questions in PDN design, such as:
• How many capacitors do you need on a board?
• What values should they be?
• How do you integrate them into the board?
Of course, as the Signal Integrity Evangelist himself commonly says, “The answer to these sorts of questions is always, ‘it depends’. And, the way you answer ‘it depends’ questions is first by understanding the essential principles and then by putting in the numbers.”
This Webinar will introduce the essential principles of PDN design and then look at some of the considerations and analysis techniques that influence the decision of how many and what value capacitors should be used for typical power distribution networks.
The Webinar is at 1 pm EST on December 9, 2009. To view the Webinar live, you must register by December 8 at beTheSignal.com. It will also be available as a recording from the beTheSignal.com Web site. The entire 2009 webinar series and all the additional supplemental materials for each Webinar, can be viewed as part of the 2009 No Myths Allowed Continuing Education Curriculum.
For more information, contact Susan@beThesignal.com or visit beTheSignal.com IEEE EMC Distinguished Lectures - April 13, 2009
Oregon and SW Washington Chapter of the IEEE EMC Society
* "Separating Myth from Reality in Signal Integrity"
* "S-Parameters for SI Applications"
* "From Bit Banger to Gigabit Guru"
* "The Ten Habits of Highly Successful Board Designers" IPC Designer Day at IPC Expo - March 30, 2009 IEEE EMC Distinguished Lecture Talks - March 17, 2009 Rocky Mountain Chapter of the EMC Society
* 1:00PM-2:00PM: "Separating Myth from Reality in Signal Integrity"
* 2:30PM-4:00PM: "S-Parameters for SI Applications"
* 4:30PM-6:00PM: "From Bit Banger to Gigabit Guru"
* 7:00PM-8:30PM: "The Ten Habits of Highly Successful Board Designers" DesignCon - February 2009 Technical Panels:
IEEE EMC Distinguished Lecture Talks - January 2009
- January 20, 2009 - Dallas Chapter of the IEEE EMC Society
"The Ten Habits of Highly Successful Board Designers"
PRESS RELEASE - New Blog by Dr. Eric Bogatin - July 2008 PRESS RELEASE
NEW BLOG IN PLACE AT BETHESIGNAL.COM
Learn what Dr. Bogatin has learned this month
Olathe, KS – July 3, 2008 – Bogatin Enterprises and beTheSignal.com announce the release of a new blog hosted by Dr. Eric Bogatin . "What I've Learned This Month" features topical issues related to signal integrity. An important feature of this blog will be to identify future technology advancements for signal integrity engineers, and break down the barriers to understanding.
"During 2008, our development efforts have been focused on building our educational content", states Susan Merys Bogatin, Chief Operating Officer. "We consider this blog to be an important component in our attempt to reach SI engineers with the most current information available, in a format that's easy to understand".
Dr. Bogatin 's blog can be reached at www.beTheSignal.com/blog.
About Bogatin Enterprises, LLC
For 20 years, Bogatin Enterprises has been a leading provider of signal integrity training. They offer a full curriculum of on-site and public classes and, through BeTheSignal.com, offer web-based training, online lectures, application notes and feature articles. Subscriptions are available for individuals, small groups and at the corporate level. Contact them at info@beTheSignal.com. PRESS RELEASE - Professional Certification Announced - SEPT. 5, 2008 Bogatin Enterprises Partners with IEEE Educational Programming
OLATHE, KS -- Bogatin Enterprises and the IEEE (Institute of Electrical and Electronics Engineers) announce a Professional Development Certification Program in conjunction with the IEEE’s Educational Partner’s Program. This partnership expands the offerings of Bogatin Enterprises and beTheSignal.com, providing a series of signal integrity and electrical design focused certification programs that cover the latest in high-speed design, simulation and modeling techniques.
In January 2009, this collaboration will create a new learning platform that combines traditional classroom education opportunities with a strong distance-learning program that will facilitate access for signal integrity engineers world-wide. Through this program, discounts for the Bogatin Enterprises Professional Development Certification Program will be available for all IEEE members.
The IEEE is partnering with providers from academia and corporations to provide the IEEE membership the most effective learning resources. The Partners are a carefully selected number of universities and corporations reviewed and approved by highly qualified IEEE volunteers.
“We’ve been growing our course content through traditional classroom training and distance learning for several years”, stated Susan Bogatin, Chief Operating Officer. “Partnering with the IEEE Education Partner’s Program allows us to have the perfect vehicle for providing a comprehensive Certification program to enhance the careers of signal integrity engineers.”
About Bogatin Enterprises, LLC
For 20 years, Bogatin Enterprises has been a leading provider of signal integrity training. They offer a full curriculum of on-site and public classes and, through BeTheSignal.com, offer web-based training, online lectures, application notes and feature articles. Subscriptions are available for individuals, small groups and at the corporate level. Contact them at info@BeTheSignal.com
Published Articles - September 2008 NEW PUBLISHED ARTICLES - SEPT., 2008
EDN Magazine, Sept. 18 issue, "Making the Transition from Bit Banger to Gigabit Guru", with Bill Hargin of Mentor Graphics
PCD&F Magazine, Sept. 2, Feature Article
EDN ONLINE, "A streamlined method of PCI Express interconnect compliance testing", By Joseph C. (Jay) Diepenbrock, IBM Corp., Steven Corey and Dima Smolyansky, Tektronix, and Eric Bogatin Ten Things Every PCB Designer Should Know - 2008
Watch an interview with Dr. Eric Bogatin at IPC Designers Day 2008 - Las Vegas, NV. In the interview, Eric discusses ten things every PCB designer should know about signal integrity, including new ways of dealing with ground bounce.
|
|
|
|
Application Notes
